Press-Pack (Compression-Bonded) Rectifier Diodes – ZP Series

Product Overview

The ZP Series Circular Crimp Diode Chips are high-performance press-pack rectifier diodes designed for demanding industrial applications. These compression-bonded devices offer excellent thermal and electrical characteristics with current ratings from 50A to 3000A.

Key Features:

  • High surge current capability
  • Low forward voltage drop (≤1.5V)
  • Press-pack construction for optimal thermal performance
  • Wide current range: 50A to 3000A
  • Voltage rating: 1600V (VRRM)
  • Maximum junction temperature: 150°C
  • RoHS compliant
Parameter Symbol Test Conditions Min Typ Max Unit
Average Forward Current IF(AV) TC = 85°C 50 – 3000 A
Forward Voltage VFM IF = rated, T = 25°C – – 1.5 V
Repetitive Peak Reverse Voltage VRRM – 1600 – – V
Reverse Current @ 25°C IRRM VR = VRRM, T = 25°C – – 2.0 mA
Reverse Current @ 150°C IRRM VR = VRRM, T = 150°C – – 30 mA
Junction Temperature Tjm – -40 – 150 °C

Available Models

Model IF(AV) (A) Chip Ø (mm) Thickness (mm) Cathode Ø (mm) Test Current (A) Test Pressure (kN)
ZPφ15P-16 50 15±0.1 1.4±0.1 ≥11 150 3
ZPφ17P-16 60 17±0.1 1.4±0.1 ≥13.5 200 3
ZPφ20P-16 100 20±0.1 1.4±0.1 ≥16 300 3
ZPφ24P-16 200 24±0.1 1.6±0.1 ≥20 600 5
ZPφ26P-16 250 26±0.1 1.6±0.1 ≥22 750 5
ZPφ30P-16 300 30±0.1 1.6±0.1 ≥26 900 7
ZPφ35P-16 500 35±0.1 1.8±0.1 ≥31 1500 10
ZPφ40P-16 800 40±0.1 2.1±0.1 ≥35 2400 15
ZPφ45P-16 1000 45±0.1 2.3±0.1 ≥40 3000 18
ZPφ50P-16 1200 50±0.1 2.4±0.1 ≥45 3600 22
ZPφ55P-16 1500 55±0.1 2.4±0.1 ≥49 4500 27
ZPφ60P-16 1800 60±0.1 2.5±0.1 ≥54 5400 30
ZPφ65P-16 2000 65±0.1 2.8±0.1 ≥59 6000 30
ZPφ70P-16 2500 70±0.1 2.9±0.1 ≥64 7500 30
ZPφ76P-16 3000 76±0.1 3.4±0.1 ≥70 9000 30

Internal Structure

The circular crimp diode chips feature a multi-layer construction optimized for high current handling and thermal performance:

Upper Electrode (AL) ≥8μm
Protection Layer (PI+985)
Single Crystal Silicon
0.36±0.05mm
Lower Electrode (MO)
1.0-3.0mm
Layer Material Thickness Function
Upper Electrode Aluminum (AL) ≥ 8μm Primary electrical contact
Protection Layer PI+985 – Junction edge passivation
Silicon Die Single Crystal Silicon 0.36±0.05mm Active semiconductor junction
Lower Electrode Molybdenum (MO) 1.0-3.0mm* Thermal expansion matching

*Thickness varies by model

Applications

Circular crimp diode chips are widely used in high-power industrial applications:

AC/DC Power Converters
Motor Drive Systems
Welding Equipment
UPS Systems
Railway Traction
Wind Power Generation
Industrial Heating
Electrochemical Processing
HVDC Transmission
Diode Chip application

 

Ordering Information

Model Nomenclature: ZPφ[diameter]P-[voltage class]

  • ZP = Press-pack rectifier diode
  • φ = Diameter symbol
  • [diameter] = Chip diameter in mm
  • P = Press-pack type
  • [voltage class] = Voltage rating ÷ 100 (e.g., 16 = 1600V)

Example: ZPφ40P-16 = 40mm diameter press-pack diode, 1600V rating

Contact Us

For professional consultation or custom services about circular soldered diode chips, please contact us:

Phone: +86 17328818782
Email: jastpower@yandex.com

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