Circular Soldered Diode Chips 10-500A

Circular Soldered Diode Chips

Soldering Layer: Lead-Tin Alloy (95:5) for robust connection.
Upper Electrode: Molybdenum base for high conductivity and thermal stability.
Active Layer: High-purity Monocrystalline Silicon (MCZ).
Lower Electrode: Molybdenum base.
Protection: GD406 glass passivation for environmental protection and voltage stability.

Key Features

Product Series Overview

Model	I_F(AV) (A)	Chip Dia. (mm)	Effective Dia. (mm)	Weldable Dia. (mm)	Chip Thick. (mm)	V_RRM (V)	T_jm (°C)
ZP∮7L-16	10	7.0	≥3.6	≥3.0	2.2±0.2	≥1600	160
ZP∮9L-16	15	9.0	≥5.6	≥5.0	2.5±0.2	≥1600	160
ZP∮11L-16	20	11.0	≥7.6	≥6.0	2.5±0.2	≥1600	160
ZP∮12L-16	30	12.0	≥8.6	≥7.0	2.5±0.2	≥1600	160
ZP∮13L-16	50	13.0	≥9.6	≥8.0	2.6±0.2	≥1600	160
ZP∮14L-16	60	14.0	≥10.6	≥9.0	2.6±0.2	≥1600	160
ZP∮16L-16	80	16.0	≥12.6	≥11.0	2.6±0.2	≥1600	160
ZP∮18L-16	100	18.0	≥14.6	≥12.0	2.6±0.2	≥1600	160
ZP∮20L-16	130	20.0	≥16.0	≥14.0	2.7±0.2	≥1600	160
ZP∮22L-16	150	22.0	≥18.0	≥16.0	2.7±0.3	≥1600	160
ZP∮24L-16	200	24.0	≥19.0	≥17.0	2.7±0.3	≥1600	160
ZP∮26L-16	250	26.0	≥21.0	≥19.0	2.9±0.3	≥1600	160
ZP∮28L-16	300	28.0	≥23.0	≥21.0	2.9±0.3	≥1600	160
ZP∮30L-16	300	30.0	≥25.0	≥23.0	2.9±0.3	≥1600	160
ZP∮36L-16	400	36.0	≥31.0	≥29.0	3.6±0.4	≥1600	160
ZP∮40L-16	500	40.0	≥34.0	≥33.0	3.6±0.4	≥1600	160

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